Brief: Discover the advanced FPC HDI 50um Laser Direct Imaging Equipment with a 610x710mm exposure size. Perfect for PCB, HDI, and FPC applications, this 380V three-phase LDI system offers precision and efficiency for high-mix and mass production environments.
Related Product Features:
High-resolution laser direct imaging (LDI) system with 30um mass production capability.
Supports PCB, HDI, and FPC applications for inner layer, outer layer, and anti-welding processes.
Exposure size of 610x710mm, accommodating panel thickness from 0.05mm to 3.5mm.
Advanced alignment mode with UV-Mark and ±12um outer layer alignment capability.
Flexible deviation adjustment modes including fixed, automatic, and interval increase and contraction.
Utilizes LD Laser with 405±5nm wavelength for precise imaging.
Compatible with Gerber 274X and ODB++ file formats for seamless integration.
Operates on 380V three-phase AC, 6.4kW power, ensuring stable performance in controlled environments.
الأسئلة الشائعة:
What is laser direct imaging (LDI) and how does it work?
Laser direct imaging (LDI) uses a computer-controlled laser beam to digitally create circuit traces on a photo-sensitive PCB surface, eliminating the need for photo tools. The laser scans the board to match a pre-loaded CAD/CAM design file, ensuring precise imaging.
What applications is this LDI system suitable for?
This system is ideal for PCB, HDI, and FPC applications, including inner layer, outer layer, and anti-welding processes, offering versatility for various production needs.
What are the environmental requirements for operating this LDI system?
The system requires a yellow light room with temperature maintained at 22°C ±1°C, humidity at 50% ±5%, and cleanliness level of 10000 or above. Avoid violent vibration near the equipment for optimal performance.